Thin film technology handbook / Aicha A. R. Elshabini-Riad, and Fred D. Barlow.

CONTENT

Chapter 1.Film deposition techniques and processes
1.1 Introduction
1.2 Vacuum systems
1.3 Evaporation
1.4 Molecular beam epitaxy
1.5 Sputter deposition
etc.

Chapter 2 Pattern generation techniques
2.1 Introduction
2.2Pattern generation
2.3 Microlithography
2.4 Optical tools for microlithography
2.5 Etching
etc.

Chapter 3 Properties of thin film materials
3.1 Introduction
3.2 Substrates for thin film applications
3.3 Thin film conductor material
3.4 Resistors for thin film applications
3.5 Thin film dielectrics
etc.

Chapter 4 Principles and properties of semiconductor thin films
4.1 Introduction
4.2 Transport mechanisms in polycrystalline semiconductors
4.3 Properties of amorphous thin films
4.4 Optical properties of semiconductor films
4.5 Summary

Chapter 5 Design guidelines for thin film components and construction of thin molecules
5.1 Introduction
5.2 Thin film design guidelines
5.3 Multichip modules deposited (MCM-D)
5.4 Thermal considerations
5.5 Component attachment
etc.

Chapter 6 Characterization of semiconductor thin films: A compendium of techniques
6.1 Introduction
6.2 Electro-optical measurements: Film properties
6.3 Electro -optical measurements: Grain boundaries
6.4 Chemical, compositional and structural determinations
6.5 Nano-scale and atomic-scale measurements
etc.

Chapter 7 Diamond film
7.1 Introduction
7.2 Nucleation and growth
7.3 Properties of diamond
7.4 Applications
7.5 Summary

Chapter 8 Thin film optical materials
8.1 Introduction
8.2 Propagation of light through media
8.3 Behavior of light at interfaces
8.4 Interference in thin film
8.5 Multilayer optical coatings
etc.

Chapter 9 Thin film packaging and interconnect
9.1 Introduction
9.2 IC and system drivers
9.3 Electrical characteristics of thin film connections
9.4 Materials of constructions
9.5 Thin film processes and applications
etc.

Chapter 10 Thin film for microwave hybrids
10.1 Introduction
10.2 Planar transmission structures
10.3 Transmission line parameters
10.4 Microstrip line
10.5 Coplanar transmission line
etc.

Chapter 11 Yield, testing and reliability
11.1 Introduction to testing of microelectronic components and subassemblies
11.2 Preparing for testing
11.3 Automated test equipment ( ATE )
11.4 Electrical test interface
11.5 Test and evaluation methods
etc.

Includes bibliographical references and index.